New SMT Equipment: head on (2)

Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb

Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb

New Equipment | Rework & Repair Equipment

Semi automatic bga rework station machine to desolder and solder chip on mobile pcb Features: 1. Made of quality heating material;desoldering and solding  procedures of BGA are precisely controlled; 2. Movable heating head,which can be moved

Shenzhen Honreal Technology Co.,Ltd

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

New Equipment | Pick & Place

Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production

ASM Assembly Systems GmbH & Co. KG

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Electronics Forum: head on (124)

Rheometric pump head on MPM HiE

Electronics Forum | Wed May 21 13:38:22 EDT 2008 | pjc

Solderpaste types have a big effect on print performance. Go to this link to see if the solderpaste you are using has been tested, see "Rheometric Pump Paste Tests" under MPM: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnI

Rheometric pump head on MPM HiE

Electronics Forum | Wed May 21 09:03:52 EDT 2008 | bing007

I have been confronted with a MPM with a rheometric pump head on and have not had much to do with these. It is giving varying results on the down line paste AOI and is not responding very much to changes in pressure, speed etc. It is a 16inch pump, w

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Industry News: head on (65)

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2013-04-02 17:20:44.0

The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

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Parts & Supplies: head on (21)

Yamaha main stopper on YV100II KU0-M9160-01X

Yamaha main stopper on YV100II KU0-M9160-01X

Parts & Supplies | Pick and Place/Feeders

Yamaha main stopper on YV100II KU0-M9160-01X Yamaha parts: 1 KV7-M9161-00X PLATE,STOPPER 1 2 KV7-M9162-01X BRKT.,STOPPER 1 3 KV7-M9163-00X STOPPER 1 4 KV7-M9164-00X BRKT.,CYLINDER 1 5 KV7-M9165-01X CYLINDER:PDAS6X40 1 6 KV7-M9166-00X GUIDE (LW

ZK Electronic Technology Co., Limited

Yamaha Top YAMAHA Cl 24mm Feeder Cl Feeder on Sale

Yamaha Top YAMAHA Cl 24mm Feeder Cl Feeder on Sale

Parts & Supplies | Assembly Accessories

 Yamaha feeder in stork: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-000 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K

KingFei SMT Tech

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Technical Library: head on (3)

Influence of Salt Residues on BGA Head on Pillow (Hip)

Technical Library | 2016-05-26 15:07:36.0

The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.

Continental Corporation

Effects of Package Warpage on Head-in-Pillow Defect

Technical Library | 2017-07-06 15:50:17.0

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.

Samsung Electronics

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Videos: head on (2)

Thermal paste dispensing by the DV-8000 on a D-583

Thermal paste dispensing by the DV-8000 on a D-583

Videos

Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

Mx400L in production on a 243 pc board using front and rear gantries simultaneously

Mx400L in production on a 243 pc board using front and rear gantries simultaneously

Videos

Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me

Apex Factory Automation

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Express Newsletter: head on (145)


head on searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

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Component Placement 101 Training Course
PCB Handling with CE

Stencil Printing 101 Training Course
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

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